Dosing technology suitable for your requirements

Application examples

Bonding

Bonding

Bonding means structural adhesive bonding in the industrial production and construction with a dispenser. Due to the volumetric adhesive dispensing nearly every active agent combination of all kinds can be connected with each other. Therefore traditional technics such as riveting or welding are replaced.

Optical Bonding

Optical Bonding

Optical Bonding means a clear adhesive is applied between the layers of glass in a touch screen display to improve the performance of the display when outdoors. This procedure eliminates the gap between the glass and the display (in smartphones and tablets). Even cover glasses can be put on.

Conformal Coating

Conformal Coating

Conformal Coating is a protective coating which takes the form of a non-transparent or transparent varnish that is applied to the whole or to parts of PCBs. The materials are usually high viscosity thermal or UV curing materials and are dosed onto the PCB using either a thin film or a thick film procedure.

Dam & Fill

Dam & Fill

In Dam & Fill applications, the protection of highly complex areas within an assembly comes first. As a first step, a high viscosity barrier, known as the “Dam”, is applied to the surface to be sealed. Then the isolated area is filled with a filler. This is to provide protection and also a sealing effect.

Glob Top

Glob Top

Glob Top potting protects sensitive components, usually semiconductor chips, from mechanical stress such as vibrations or temperature fluctuations. External environmental factors too, like moisture or corrosion, are thus prevented from having an impact on the potted components. This effect is realised by applying a fluid resin matrix, mostly an epoxy resin adhesive, which is then cured.

Underfill

Underfill

Underfill applications usually are used with isotropic conductive adhesives. In this case, the isotropic conductive adhesive provides the electrical connection from the microchip to the substrate. As this adhesive is not applied over the entire surface, after the thermally or UV curing process, another filling of the hollow space is necessary, the so called “Underfill”. For more process reliability.

Microdispensing

Microdispensing

Micro Dispensing means dosing of fluids in volumes from just one microlitre on – one of the challenges of continuing miniaturization in all technical areas. Fields of application are, for example, bead dosing, sealing, dot dosing, potting and two-component dispensing. For these applications in particular high levels of precision, maximum repeat accuracy and highest reliability are mandatory.

Encapsulating

Encapsulating

Encapsulating means applying a liquid sealing compound to a defined area on a component or surface. The sealing compound protects the electrical component in transports and from environmental influences such as vibration, humidity, dust and extreme temperature. Other benefits are improved electrical insulation, a higher safety against damage as well as a better chemical resistance.

Services

Testing the products and get them approved through preeflow

Help with choosing the right metering components and small dosing devices

Combination of complete dosing systems and dosing devices, if necessary

Publishing of every tested media on this site after manufacturers approval

Testing your products or applications together live via video conference

Material examples

  • 1K and 2K Epoxy

  • UV & light curing

  • heat curing

  • gasoline

  • high fill fluids

  • anaerobic adhesives

  • shear-sensitive adhesives

  • LED resins

  • toluene

  • thermal conductive paste

  • sealing agents

  • flavours

  • solder paste

  • RTV rubbers

  • silver paste

  • flux

  • industrial oils

  • and many more

  • isopropanol

  • cosmetics & medicines

  • biotechnical suspensions

  • silicones

  • epoxy resin

  • alcohol

  • thermal grease

  • MEK

  • grease

  • PU

  • paints & inks

  • primer

  • acetone

  • brazing paste

  • electrolytic solutions

  • perfume

Diverse application fields in various industries:

Optics & photonics

Medical Technology

Biochemistry

LCD / LED

Photovoltaics

Laboratories

SMD / SMT

Electronic components

Semiconductors

and many more

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